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Jednostka: STATS ChipPAC
LEI 254900S2HH22EA4E3664

Nazwa organizacji
STATS ChipPAC Ltd.
Nazwa kraju
Singapur
Kraj rejestracji
Singapur
Branża
Półprzewodniki
Dług obligacyjny
-

poznaj najbardziej kompletną bazę danych

800 000

obligacje na całym świecie

Ponad 400

źródła kształtowania cen

80 000

akcje

9 000

ETF

najskuteczniej kontroluj swój portfel
skaner obligacji
Lista do obejrzenia
DODATEK Excel

Ostatnie dane na

Notowania

Zapytanie wysłano
Dostęp zamknięty
Notowania dostarczane przez dostawców informacji mają charakter orientacyjny

Profil

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. Our services include: •Packaging services: providing leaded, laminate, memory card and wafer level chip-scale packages (CSP) to customers with a broad range of packaging solutions and full backend turnkey services for a wide variety of electronics applications. We also provide redistribution layers (RDL), integrated passive devices (IPD) and wafer bumping services for flip chip and wafer level CSPs. As part of customer support on packaging services, we also offer package design; electrical, mechanical and thermal simulation; measurement and design of leadframes and laminate substrates. •Test services: including wafer probe and final testing on a diverse selection of test platforms covering the major test platforms in the industry. We have expertise in testing a broad variety of semiconductors, especially mixed-signal, radio frequency (RF), analog and high-performance digital devices. We also offer test-related services such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack and tape and reel. •Pre-production and post-production services: such as package development, test software and related hardware development, warehousing and drop shipment services. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.

Nagrody

Dokumenty

Akcje

Ostatnie emisje

Dług obligacyjny wg walut

Kody

  • LEI
    254900S2HH22EA4E3664
  • SIC
    3674 SEMICONDUCTORS & RELATED DEVICES
  • ICB
    9.500 Technology
  • CIK
    0001101873

Ratingi kredytowe i ESG

Makroekonomia

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