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New bond issue: Chengdu Communications Investment Group will issue international bonds (XS1733835257) with a 4.75% coupon for USD 300.0m maturing in 2027

06 grudzień 2017 | Cbonds

December 06, 2017 Chengdu Communications Investment Group will issue international bonds (XS1733835257) with a 4.75% for USD 300.0m maturing in 2027. Bonds were sold at a price of 99.701%. Bookrunner: China International Capital Corporation (CICC). Depository: Euroclear Bank, Clearstream Banking S.A.

Issue: Chengdu Communications Investment Group, 4.75% 13dec2027, USD

StatusCountry of riskRedemption (offer)VolumeEmission Rating (M/S&P/F)
W obrocieChina13.12.2027300.000.000 USD-/-/BBB+

Organizacja: Chengdu Communications Investment Group

Pełna nazwa firmyChengdu Communications Investment Group
Country of riskChina
Country of registrationChina
IndustryBudownictwo i rozwój

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