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New bond issue: Wuhan Dangdai Science & Technology Industries Group issued international bonds (XS1717215047) with a 7.25% coupon for USD 300.0m maturing in 2020

14 listopad 2017 | Cbonds

November 13, 2017 Wuhan Dangdai Science & Technology Industries Group issued international bonds (XS1717215047) with a 7.25% for USD 300.0m maturing in 2020. Bonds were sold at a price of 100% with an initial yield of 7.25%. Bookrunner: Bank of China, Bank of Communications, CITIC Securities International, China Everbright Bank, China Silk Road International Capital, CLSA, China Merchants Bank, Haitong International securities, Industrial Bank, SPDB International Holdings Limited, UBS, Wing Lung. Depository: Euroclear Bank, Clearstream Banking S.A.

Issue: Wuhan Dangdai Science & Technology Industries Group, 7.25% 20nov2020, USD

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
W obrocieChina20.11.2020300.000.000 USD -/-/-

Organizacja: Wuhan Dangdai Science & Technology Industries Group

Pełna nazwa firmyWuhan Dangdai Science & Technology Industries Group Co. Ltd.
Country of riskChina
Country of registrationChina
IndustryHealthсare

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