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New bond issue: Softbank Group issued international bonds with a 4.75% coupon for USD 1,350.0m maturing in 2024

13 wrzesień 2017 | Cbonds

September 12, 2017 Softbank Group issued international bonds with a 4.75% for USD 1,350.0m maturing in 2024. Bonds were sold at a price of 100% with an initial yield of 4.8064%. Bookrunner: Bank of America Merrill Lynch, Barclays, BNP Paribas, Citigroup, Credit Agricole CIB, Deutsche Bank, Goldman Sachs, JP Morgan, UBS
Depository: Clearstream Banking S.A., DTCC.


Emission: Softbank Group, 4.75% 19sep2024, USD

StatusCountry of riskRedemption (offer)VolumeEmission Rating (M/S&P/F)
W obrocieJapan19.09.20241.350.000.000 USDBB+/Ba1/-

Organizacja: Softbank Group

Pełna nazwa firmySoftbank Group Corp
Country of riskJapan
Country of registrationJapan
IndustryTelekomunikacja

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