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New bond issue: Summit Materials issued international bonds (USU8603VAJ18) with a 5.25% coupon for USD 700.0m maturing in 2029

31 lipiec 2020 | Cbonds

July 27, 2020 Summit Materials issued international bonds (USU8603VAJ18) with a 5.25% for USD 700.0m maturing in 2029. Bonds were sold at a price of 100%. Bookrunner: Barclays, Bank of America Merrill Lynch, Capital One Financial Corporation, Citigroup, Deutsche Bank, Goldman Sachs, RBC Capital Markets, Jefferies. Depository: Clearstream Banking S.A., Euroclear Bank.

Issue: Summit Materials, 5.25% 15jan2029, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieUSA15.01.2029700.000.000 USD-/BB/-

Organizacja: Summit Materials

Pełna nazwa firmySummit Materials, LLC
Country of riskUSA
Country of registrationUSA
IndustryBudownictwo i rozwój


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