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New bond issue: Autodesk issued international bonds (US052769AG12) with a 2.85% coupon for USD 500.0m maturing in 2030

09 styczeń 2020 | Cbonds

January 07, 2020 Autodesk issued international bonds (US052769AG12) with a 2.85% for USD 500.0m maturing in 2030. Bonds were sold at a price of 99.775%. Bookrunner: Bank of America Merrill Lynch, Citigroup, JP Morgan, Mitsubishi UFJ Financial Group, U.S. Bancorp, Wells Fargo. Depository: Clearstream Banking S.A., Euroclear Bank, DTCC.

Issue: Autodesk, 2.85% 15jan2030, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieUSA15.01.2030500.000.000 USDBaa2/BBB/-

Organizacja: Autodesk

Pełna nazwa firmyAutodesk Inc
Country of riskUSA
Country of registrationUSA
IndustryInformation and High Technologies


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