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New bond issue: Amkor Technology issued international bonds (USU03169AM81) with a 6.625% coupon for USD 525.0m maturing in 2027

14 marzec 2019 | Cbonds

March 13, 2019 Amkor Technology issued international bonds (USU03169AM81) with a 6.625% for USD 525.0m maturing in 2027. Bonds were sold at a price of 99.5%. Bookrunner: Bank of America Merrill Lynch, Morgan Stanley. Depository: Clearstream Banking S.A., Euroclear Bank.

Issue: Amkor Technology, 6.625% 15sep2027, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieUSA15.09.2027525.000.000 USD-/BB/-

Organizacja: Amkor Technology

Pełna nazwa firmyAmkor Technology, Inc.
Country of riskUSA
Country of registrationUSA
IndustryInformation and High Technologies

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