Contact us (+ 7 (921) 446-25-10)
Texting is available for authorized users.
Please register or log in at the website.
Your request for online training has been sent. Cbonds managers will be in touch with you shortly. Thank you!

New bond issue: Amkor Technology issued international bonds (USU03169AM81) with a 6.625% coupon for USD 525.0m maturing in 2027

14 marzec 2019 | Cbonds

March 13, 2019 Amkor Technology issued international bonds (USU03169AM81) with a 6.625% for USD 525.0m maturing in 2027. Bonds were sold at a price of 99.5%. Bookrunner: Bank of America Merrill Lynch, Morgan Stanley. Depository: Clearstream Banking S.A., Euroclear Bank.

Issue: Amkor Technology, 6.625% 15sep2027, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieUSA15.09.2027525.000.000 USD-/BB/-

Organizacja: Amkor Technology

Pełna nazwa firmyAmkor Technology, Inc.
Country of riskUSA
Country of registrationUSA
IndustryInformation and High Technologies


Similar news:
Cbonds is a global fixed income data platform
  • Cbonds is a global data platform on bond market
  • Coverage: more than 170 countries and 250,000 domestic and international bonds
  • Various ways to get data: descriptive data and bond prices - website, xls add-in, mobile app
  • Analytical functionality: bond market screener, Watchlist, market maps and other tools