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New bond issue: AT&T Inc issued international bonds (US00206RFZ01) for USD 1,500.0m maturing in 2021

22 czerwiec 2018 | Cbonds

AT&T Inc issued international bonds (US00206RFZ01) for USD 1,500.0m maturing in 2021. Bonds were sold at a price of 100%. Bookrunner: Bank of America Merrill Lynch, U.S. Bancorp. Depository: Clearstream Banking S.A., Euroclear Bank.

Issue: AT&T Inc, FRN 1jun2021, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieUSA01.06.20211.500.000.000 USDBaa2/BBB/A-

Organizacja: AT&T Inc

Pełna nazwa firmyAT&T Inc
Country of riskUSA
Country of registrationUSA
IndustryTelekomunikacja

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