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International bonds: Advanced Micro Devices, 7% 1jul2024, USD (US007903BC08)

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Trace-eligible, Senior Unsecured

Status
Early redeemed
Amount
499,677,000 USD
Placement
***
Early redemption
*** (-)
ACI on
Country of risk
USA
Current coupon
***%
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    499,677,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • ISIN
    US007903BC08
  • CFI
    DBFUGR
  • FIGI
    BBG006YTKG70
  • SEDOL
    BQSMCP8
  • Ticker
    AMD 7 07/01/24

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Issue information

Profile
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and ...
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and consumer markets, embedded microprocessors for commercial, commercial client and consumer markets and chipsets for desktop and mobile devices, including mobile personal computers, or PCs, and tablets, professional workstations and servers and graphics, video and multimedia products for desktop and mobile devices, including mobile PCs and tablets, home media PCs and professional workstations, servers and technology for game consoles. In September 2013, Advanced Micro Devices Inc announced that its Singapore subsidiary, Advanced Micro Devices (Singapore) Pte Ltd. completed a transaction to sell and lease-back its Singapore facility located at 508 Chai Chee Lane, Singapore 469032 to HSBC Institutional Trust Services (Singapore) Limited.
Volume
  • Placement amount
    499,677,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

Early redemption terms

***

explore the most comprehensive database

800 000

bonds globally

Over 400

pricing sources

80 000

stocks

9 000

ETF

track your portfolio in the most efficient way
Bond Search
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— Are you looking for the complete & verified bond data?

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Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
Get full access to the platform from any device & via Cbonds app
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

Additional information

Latest issues

Identifiers

  • ISIN
    ***
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG006YTKG70
  • WKN
    A1ZWB0
  • SEDOL
    BQSMCP8
  • Ticker
    AMD 7 07/01/24
  • Type of security by CBR
    ***

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk

Restructuring

***

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